Centrino

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Centrino, a platform-marketing initiative from Intel, covers a particular combination of CPU, mainboard chipset and wireless network interface in the design of a laptop personal computer.

1 Successive implementations
2 Marketing
3 See also
4 References
5 External links

[edit] Successive implementations

[edit] Carmel platform

Intel used Carmel as the code name for the first-generation Centrino platform launched in March 2003.

The Carmel platform consists of:

an Intel Pentium M processor (code named Banias or later Dothan) with a 400 MT/s FSB,
an Intel 855 series chipset (code named Odem or Montara), and
an Intel PRO/Wireless 2100 or later 2200 (IEEE 802.11b) mini-PCI Wi-Fi adapter (code named Calexico or Calexico2).

Industry-watchers initially criticized the Carmel platform for its lack of an IEEE 802.11g-solution, because many independent Wi-Fi chip-makers like Broadcom and Atheros had already started shipping 802.11g products. Intel responded that the IEEE had not finalized the 802.11g standard at the time of Carmel's launch, and that it did not want to launch products not based on a finalized standard.

In early 2004, after the finalization of the 802.11g standard, Intel permitted an Intel PRO/Wireless 2200BG (code named Calexico2) to substitute for the 2100. At the same time, they permitted the new Dothan Pentium M to substitute for the Banias Pentium M.

Initially, Intel permitted only the 855GM chipset, which did not support external graphics. Later, Intel allowed the 855GME and 855PM chips, which did support external graphics, in Centrino notebooks.

Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Carmel could attain or exceed the performance of older Pentium 4-M platforms, while allowing for notebooks to operate for 4 to 5 hours on a 48 W-h battery. Carmel also allowed notebook-manufacturers to create thinner and lighter notebooks because its components did not dissipate much heat, and thus did not require large cooling systems.

[edit] Sonoma platform

Image:CentrinoLogoV2.png

Sonoma-era Centrino logo

Intel used Sonoma as the code name for the second-generation Centrino platform, launched in January 2005.

The Sonoma platform consists of:

an Intel Pentium M processor (code-named Dothan) with a 533 MT/s FSB,
an Intel Mobile 915 Express series chipset (code-named Alviso), and
the Intel PRO/Wireless 2200 or 2915ABG mini-PCI Wi-Fi adapter (code-named Calexico2).

The Mobile 915 Express chipset, like its desktop version, supports many new features such as DDR2, PCI Express, Intel High Definition Audio, and SATA. Unfortunately, the introduction of PCI Express and faster Pentium M processors causes notebooks built around the Sonoma platform to have a shorter battery-life than their Carmel counterparts; Sonoma notebooks typically achieve between 3.5-4.5 hours of battery-life on a 53 W-h battery.

[edit] Napa platform

Image:CentrinoLogoV3.png

Napa-era Centrino logo

Image:CentrinoLogoV3-Duo.png

Napa-era Centrino Duo logo

The code-name Napa designates the third-generation Centrino platform, introduced in January 2006 at the Winter Consumer Electronics Show.

The platform consists of:

an Intel Core (code-named Yonah) or Core 2 processor (code-named Merom)
an Intel Mobile 945 Express-series chipset (code-named Calistoga), and
the Intel PRO/Wireless 3945ABG mini-PCIe Wi-Fi adapter (code-named Golan).

Intel uses Centrino Duo branding for laptops with dual-core ("Core Duo") processors and retains the Centrino name for laptops with single core ("Core Solo") processors.

[edit] Santa Rosa platform

The code-name Santa Rosa refers to the fourth-generation Centrino platform, scheduled for release in April 2007 with the following features:<ref>Stokes, Jon. Intel boosts Centrino. ArsTechnica. Retrieved on 2006-09-29.</ref>

second generation Intel Core 2 processor (code named Merom) that uses Socket P
800 MT/s front side bus with Dynamic Front Side Bus Switching to save power during low utilization
Intel Mobile 965 Express chipset (code named Crestline) with Intel's GMA X3000 graphics technology
Intel PRO/Wireless 4965AGN IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter (code named Kedron)
NAND flash-memory caching (code-named Robson)
WWAN Internet access via HSDPA codeveloped with Nokia (code-named Windigo) [1][2]
EFI, a successor to BIOS
WiMAX [3]
Intel Dynamic Acceleration (IDA), better Windows Vista Aero support [4]

The Santa Rosa platform will be branded as "Centrino Pro".[5]

[edit] Montevina platform

The code-name Montevina refers to the fifth-generation Centrino platform, scheduled for release in 2008. Montevina will support Penryn, Intel's 45nm die-shrink version of its current generation of 65nm Core 2 processors. The 45nm chip is planned to consume no more than 29W, compared to Merom's 35W TDP. Penryn will also see the debut of SSE4, which will add 50 new instructions to SSSE3. Montevina comprises the Cantiga chipset, along with a new wireless module called Shiloh, and a LAN controller codenamed Boaz. <ref>Tony Smith (2006-10-11). Intel to follow 'Santa Rosa' Centrino with 'Montevina'. The Register.</ref>

Cantiga will increase the frontside bus speed to 1,067MHz and reports suggest support for 800MHz DDR 3 in preference to the less power-efficient 800MHz DDR 2. The chipset family will include an integrated part containing ten pixel shaders, up from the GMA 3000's eight. The graphics core is expected to be clocked at 475MHz.

Like the fourth-generation model, Shiloh is expected to support WiMAX as well as HSDPA (3.5G).

[edit] Marketing

Intel has reportedly invested US$300 million in Centrino advertising. Because of the ubiquity of the marketing campaign, many consumers mistakenly refer to Pentium M and Intel Core processors as "Centrinos". Many consumers have received the impression that only Centrino provides wireless connectivity in a notebook. This has resulted in increased demand for Intel's PRO/Wireless chipsets.

The Centrino marketing program has been widely assumed to be responsible for the success of Intel notebook PCs. However, findings of the Japanese FTC in March of 2005indicate that the financial incentives associated with the Centrino program were used as illegal, anti-competitive practices by Intel to induce its customers not to buy notebook chips from Intel's long time rival AMD. In the quarter immediately following the JFTC ruling, AMD boasted more than 60 notebook computer design wins which was a strong resurgence from the drastic share reductions seen in 2003 and 2004.