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The salicide is not a material but a technology used in microelectronic industry, in particular for the fabbrication of microchip on silicon wafers (e.g. CMOS devices). The term "salicide" comes from self-aligned silicide, since no lithographic-etching processes are involved, as in the polycide technology.

Aim of this technology is to grow a silicide of a transition metal on silicon and polysilicon areas of the wafer, avoiding the reaction of the transition metal with the other materials present on the wafer (e.g. silicon oxide and silicon nitride).

Typical transition metals used in salicide technology are:

• Titanium
• Cobalt
• Nickel
• Platinum